ENME

News Story

Sandborn Named IEEE Fellow

Sandborn Named IEEE Fellow


Department of Mechanical Engineering Professor Peter Sandborn was elevated to Institute of Electrical and Electronics Engineers (IEEE) Fellow, one of the highest distinctions awarded to IEEE members who have achieved innovation and excellence in the field of engineering.

Sandborn, who also serves as director of the Maryland Technology Enterprise Institute (Mtech), was recognized for his contributions to the analysis of cost and life-cycle of electronic systems.  Sandborn earned both his M.S. and Ph.D. in electrical engineering from the University of Michigan, and he became a professor at the University of Maryland in 1998. 

Sandborn is a professor in The Center for Advanced Life Cycle Engineering (CALCE) where his group develops obsolescence forecasting algorithms, performs strategic design refresh planning and lifetime buy quantity optimization. Sandborn also performs research in life cycle cost modeling areas including maintenance planning and return on investment analysis for the application of prognostics and health management (PHM) to systems, total cost of ownership of electronic parts, transition from tin-lead to lead-free electronics and general technology tradeoff analysis for electronic systems.

Established by a small group of engineers in 1884, IEEE has grown to become a global institution.  Their mission is to foster technological innovation and excellence in the field of engineering, for the betterment of humanity. 

An IEEE fellowship is one of the most prestigious awards granted by the institute, and less 0.1% of voting members are annually selected for this recognition.

For more information on Dr. Sandborn, visit his faculty webpage or his website.

For more information on IEEE, please visit their website.

Related Articles:
IEEE Prognostics and Health Management StandardPublished by IEEE Reliability Society
Bar-Cohen Named President of IEEE Electronic Packaging Society
Yu Named ASME Fellow
Sandborn Awarded ASME Kos Ishii-Toshiba Award
Sandborn Publishes Second Edition of Cost Analysis of Electronic Systems
Schmidt Made ASME Fellow
Bruck Named SEM Fellow
Bar-Cohen Receives 2014 IEEE Components, Packaging and Manufacturing Technology Field Award
Professor Peter Sandborn Elected ASME Fellow
Srivastava & Bar-Cohen Deliver Tutorial at SEMI-THERM29

January 30, 2014


Prev   Next

Current Headlines

Larsson Named Associate Editor of AIAA Journal

Super Wood Could Replace Steel

IEEE Prognostics and Health Management StandardPublished by IEEE Reliability Society

Five Mechanical Engineering Graduate Students Named Future Faculty Fellows

Inaugural Energy Innovation Seed Grants awarded

C.D. Mote, Jr. Named a Fellow in the National Academy of Inventors

UMD Researchers Discover Methods to Mediate Membrane-Nanoparticle Interactions

Bar-Cohen Named President of IEEE Electronic Packaging Society

News Resources

Return to Newsroom

Search News

Archived News

Events Resources

Events Calendar

Additional Resources

UM Newsdesk

Faculty Experts