ENME

ENME 476 - Microelectromechanical Systems (MEMS)

3 Credits

Instructor 

Textbook 

Required book:

  • G. T. A. Kovacs, “Micromachined Transducers Sourcebook”, WCB/McGraw-Hill, Boston, 1998. ISBN 0-07-290722-3.

Recommended:

  • B. G. Streetman and S. Banerjee, “Solid State Electronic Devices”, Fifth Edition, Prentice Hall, Saddle River, 2000. ISBN 0-13-025538-6

Prerequisites 

Senior standing

Description 

Fundamentals of microelectromechanical systems (MEMS). Introduction to transducers and markets. MEMS fabrication processes and materials, including bulk micromachining, wet etching, dry etching, surface micromachining, sacrificial layers, film deposition, bonding, and non-traditional micromachining. Introduction to the relevant solid state physics, including crystal lattices, band structure, semiconductors, and doping. The laboratory covers safety, photolithography, profilometry, wet etching. 

Goals 

In this course the student will develop and/or refine the following areas of knowledge:

  • Know what types of MEMS devices there are and when it makes sense to fabricate one
  • Understand the basic concepts of semiconductor device physics
  • Understand the micromachining techniques, including what they are, when to use them, and what needs to be considered when using them
  • Demonstrate proficiency in designing process sequences
  • Be able to perform basic photolithography and patterning steps
  • Learn to keep a good laboratory notebook
  • Write a good quality design report
  • Demonstrate life learning skills such as using electronic databases, reading the journal literature, and learning by reading
  • Preparing students for graduate study or employment in MEMS
  • Demonstrating the relationships between various materials used in MEMS and how their properties can be exploited in devices and/or in device fabrication
  • Familiarizing students with various fabrication techniques, including those on the cutting edge, and how they can be combined to create various devices
  • Providing the students with an understanding of the physics underlying the engineering

Topics 

Classroom: Introduction to MEMS, transducers, markets, information resources, MEMS fabrication processes and materials, bulk micromachining, wet etching, dry etching, surface micromachining, sacrificial layers, film deposition, bonding, sacrificial layers, non-traditional micromachining, introduction to solid state physics, crystal lattices, basic atomic physics, band structure, semiconductors, band structure, doping, p-n junctions

Laboratory: safety, MSDSs, photolithography (resist spinning, alignment, exposure, development, alignment to a previous pattern), profilometry, wet etching of metals, oxide, and Si, device testing, keeping a good laboratory notebook

Learning Outcomes 

  • an ability to apply knowledge of mathematics, science, and engineering
  • an ability to design and conduct experiments, as well as to analyze and interpret data
  • an ability to design a system, component, or process to meet desired needs within realistic constraints such as economic, environmental, social, political, ethical, health and safety, manufacturability, and sustainability
  • an ability to identify, formulate, and solve engineering problems
  • an ability to communicate effectively
  • a recognition of the need for, and an ability to engage in life-long learning
  • a knowledge of contemporary issues

Class/Laboratory Schedule 

  • Two 75-minute lecture sessions per week
  • Five 3-hour laboratories during the semester
  • One in-class examination plus a final examination

Last Updated By 
Elisabeth Smela