Return to Faculty DirectoryHan, Bongtae
Research Interests
- Mechanical design of photonics and microelectronics packaging for optimum reliability;
- Physics of failure (PoF) of advanced semiconductor packaging;
- Reliability assessment and life assessment of automotive electronics;
- Mechanical characterization of electronic packaging materials;
- Experimental micro- and nano-mechanics (optical methods and methodologies)
Education
- Ph.D., Virginia Polytechnic Institute and State University, 1991
Honors and Awards
- IBM Excellence Award - for Outstanding Technical Achievements, 1994.
- Brewer Award - Outstanding Experimental Stress Analyst, Society for Experimental Mechanics, 2001.
- Gold Award (the best paper in the Analysis and Simulation session) - The 1st Samsung Technical Conference, November 9-12, 2004.
- 2004 Best Paper Award - IEEE Transactions on Components and Packaging Technologies, 2005.
- Fellow - Society for Experimental Mechanics (SEM), 2006.
- 2004 Associate Editor of the Year Award - ASME Journal of Electronic Packaging, 2006.
- Fellow - American Society for Mechanical Engineers (ASME), 2007.
- Year 2015 Best Paper Award, the 16th International Conference on Electronic Packaging Technology (ICEPT 2015).
- Year 2016 Mechanics Award, American Society of Mechanical Engineering, ASME Electronic and Photonic Packaging Division
Professional Memberships and Service
- Associate Editor, ASME Transactions, Journal of Electronic Packaging (2004-present)
- Member of International Editorial Board, Journal of Experimental Mechanics, (2005–)
- Associate Editor, Experimental Mechanics (2001-2004)
- Executive Board Member, Society for Experimental Mechanics (1997-1999)
- Member of the Organizing Committee, The 7th International Conference on Advanced Technology in Experimental Mechanics (ATEM'07)
- Member of the Scientific Committee, CompTest 2008
- Member of the Scientific Committee, Photomechanics 2008
- Member of the Organizing Committee, the 10th International Conference on Advanced Technology in Experimental Mechanics (ATEM'11), Kobe, Japan, 2011
- Member of the Technical Committee, the 2010 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2010), Xi’an, China, August 2010
Selected Publications
Book:
- D. Post, B. Han and P. Ifju, "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials," Mechanical Engineering Series, Springer-Verlag, NY, 1994. (Student edition, 1997).
Book Chapters:
- B. Han, B.-M. Song and M. Arik, “Chapter 18 Hierarchical Reliability Assessment Models for Novel LED-Based Recessed Down Lighting Systems,” Solid State Lighting Reliability, van Driel, Willem Dirk; Fan, X.J. (Eds.), Springer, NY, 2012.
- E. Stellrecht, B. Han and M, Pecht, “Ch. 5 Characterization of Hygroscopic Deformations by Moiré Interferometry,” Moisture Sensitivity of Plastic Packages of IC Devices, X. Fan and E. Suhir eds., Springer, NY, 2010.
- C. Jang and B. Han, "Ch. 8 Modeling of Moisture Diffusion and Moisture-induced Stresses in Semiconductor and MEMS Packages," Moisture Sensitivity of Plastic Packages of IC Devices, X. Fan and E. Suhir eds., Springer, NY, 2010.
- B. Han and D. Post, Chap 21, “Geometric Moire,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, NY, 2008.
- D. Post and B. Han, Chap 22, “Moire Interferometry,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, NY, 2008.
- B. Han, “14. Characterization of Stresses and Strains in Microelectronic and Photonic Devices Using Photomechanics Methods,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer, NY, 2007.
- A. Bar-Cohen, B. Han and K.-J. Kim, “2. Thermo-optic Effects on Polymer Bragg Grating,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer, NY, 2007.
- B. Han et al., Chap. 2, “Strain Measurements at the Limit-the Moiré Microscope,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.
- B. Han et al., Chap. 4, “Electronic Packaging,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.
- D. Post, B. Han and P. Ifju, Chap. 7, “Moiré Methods for Engineering and Science – Moiré Interferometry and Shadow Moiré,” Photomechanics for Engineers, Pramod Rastogi, ed., Springer-Verlag, 2000.
- D. Post, B. Han and P. Ifju, Chap. 24, “Moiré Interferometry,” Trends in Optical Nondestructive Testing and Inspection, R. K. Rastogi, D. Inaudi, ed., Elsvier Science, 2000.
Journals:
2017
- Y. Sun, H.-S. Lee, and B. Han, “Measurement of Temperature-Dependent Elastic Constants of Epoxy Molding Compound by Fiber Bragg Grating Sensor Method,” Experimental Mechanics, 57, pp. 313–324: doi: 10.1007/s11340-016-0215-5 (2017).
- B. Han and D.-S. Kim, “Moisture Ingress, Behavior and Prediction inside Semiconductor Packaging: A Review,” Journal of Electronic Packaging, Vol. 139, pp 010802-1: DOI: 10.1115/1.4035598 (2017).
2016
- D.-S. Kim and B. Han, “Effect of Junction Temperature on Heat Dissipation of High Power Light Emitting Diodes,” Journal of Applied Physics, 119, 125104 (2016); doi: 10.1063/1.4944800 (2016).
- K. Mahan, B. Kim, B. Wu, B. Han, I. Kim, H. Moon, and Y. N. Hwang, “Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages,” Microelectronics Reliability, 63, pp. 134-141: doi 10.1016/j.microrel.2016.05.015 (2016)
- K. Mahan, D. Rosen, and B. Han, “Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions,” Journal of Electronic Packaging, 138(4), 041003: doi:10.1115/1.4034454 (2016).
- D.-S. Kim, C. Holloway, B. Han, and A. Bar-Cohen, “Method for Predicting Junction Temperature Distribution in High Power Laser Diode Bar,” Applied Optics, Vol. 55, No. 27, pp. 7487-7496: doi: 10.1364/AO.55.007487 (2016).
- A. Palczynsk, P. J. Gromala, D. Mayer, B. Han, and T. Melz, “In-Situ Investigation of EMC Relaxation Behavior Using Piezoresistive Stress Sensor,” Microelectronics Reliability, 62, pp. 58–62 (2016).
2015
- H. Oh, B. Han, P. McCluskey, C. Han and B. D. Youn, “Physics-of-Failure, Condition Monitoring and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review,” IEEE Transactions on Power Electronics, Vol. 30, No. 5, pp. 2413-2416: DOI:10.1109/TPEL.2014.2346485 (2015).
- D.-S. Kim, B. Han and A. Bar-Cohen, “Characterization of Die-Attach Thermal Interface of High Power Light Emitting Diodes: An Inverse Approach,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, No. 11, pp. 1635 – 1643; doi 10.1109/ TCPMT.2015.2472400 (2015).
- J. M. Ha, B. D. Youn, H. Oh, B. Han and Y. Jung, “Autocorrelation-based time synchronous averaging for condition monitoring of planetary gearboxes wind turbines,” Mechanical Systems and Signal Processing, Vol. 70-71, pp. 161–175; doi 10.1016/j.ymssp.2015.09.040 (2015).
- H. Oh, H.-P. Wei, B. Han and B. D. Youn, “Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation Analysis and Model Calibration,” IEEE Transactions on Components, Packaging and Manufacturing Technology; doi 10.1109/TCPMT.2015.2510398 (2015).
2014
- D. Kim, B. Han and Y.-J. Kim, “Degradation Analysis of Secondary Lens System and its Effect on Performance of LED-based Luminaire,” Microelectronics Reliability, Vol. 54, No. 1, PP. 131–137; doi 10.1016/j.microrel.2013.08.007 (2014).
- Y. Sun, Y. Wang, Y. Kim and B. Han, “Dual-Configuration Fiber Bragg Grating Sensor Technique to Measure Coefficients of Thermal Expansion and Hygroscopic Swelling,” Experimental Mechanics, Vol. 54, No. 4, pp. 593-603; doi 10.1007/s11340-013-9804-8 (2014).
- C. Han and B. Han, “Board Level Reliability Analysis of Chip Resistor Assemblies under Thermal Cycling: A Comparison Study between SnPb and SnAgCu,” Journal of Mechanical Science and Technology, Vol. 28, No. 3, pp. 879-996; doi 10.1007/s12206-013-1154-z (2014).
- B. Jang and B. Han, “Hygrothermal Behavior of Advanced Polymers above Water Boiling Temperatures,” Journal of Electronic Packaging, Vol. 136, No. 1, 011013; doi 10.1115/1.4026626 (2014).
- K. Mahan, Y. Sun, B. Han, S. Han and M. Osterman, “Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth,” Journal of Electronic Packaging, Vol. 136, No. 3, 031004; doi 10.1115/1.4026922 (2014).
- Y. Sun, B. Han, E. Parsa and A. Dasgupta, “Measurement of Effective Chemical Shrinkage and Equilibrium Modulus of Silicone Elastomer Used in Potted Electronic System,” Journal of Materials Science, Vol. 49, No. 24, pp. 8301-8310; doi 10.1007/s10853-014-8538-z (2014).
2013
- B. Song and B. Han, “SPD Deconvolution Scheme for Phosphor Converted White LED Using Multiple Gaussian Functions,” Applied Optics, Vol. 52, No. 5, pp. 1016–1024 (2013).
- Y. Sun, Y. Wang, C. Jang, B. Han and K. Y. Choi, “Generalized Hybrid Modeling to Determine Chemical Shrinkage and Modulus Evolution at Arbitrary Temperatures,” Experimental Mechanics, DOI: 10.1007/s11340-013-9752-3 (2013).
- B. Song and B. Han, “Analytical/Experimental Hybrid Approach Based on Spectral Power Distribution for Quantitative Degradation Analysis of Phosphor Converted LED,” Transactions on Device and Materials Reliability, DOI: 10.1109/TDMR.2013.2269478 (2013).
- B. Song, B. Han and J.-H. Lee, “Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability,” Microelectronics Reliability, Vol. 53, No. 3, Pages 435–442 (2013).
2012
- B. Song, B. Han, A. Bar-Cohen, M. Arik, R. Sharma and S. Weaver, “Life Prediction of LED-Based Recess Downlight Cooled by Synthetic Jet,” Microelectronics Reliability, Vol. 52, No. 5, pp. 937–948 (2012).
- K. Joon Kim, A. Bar-Cohen, and B. Han, “Thermal–structural modeling of polymer Bragg grating waveguides illuminated by a light emitting diode,” Applied Optics, Vol. 51, No. 6, pp. 726-734 (2012).
- B. Han, “Measurements of True Leak Rates of MEMS Packages,” Sensors, Vol. 12, No. 3, pp. 3082-3104, (2012).
- H.-S. Seo, B. Han and Y.-J. Kim, Numerical Study on the Mixing Performance of a Ring-Type Electroosmotic Micromixer with Different Obstacle Configurations,” J. of Nanoscience & Nanotechnology, Vol. 12, pp. 4523-4530 (2012).
2011
- Y. Wang, L. Woodworth and B. Han, “Simultaneous Measurement of Effective Chemical Shrinkage and Modulus Evolutions during Polymerization,” Experimental Mechanics, Vol. 51, No. 7, pp. 1155–1169 (2011).
2010
- C. Jang, B. Youn, P. F. Wang, B. Han and S.-J. Ham, “Forward-stepwise Regression Analysis for Fine Leak Batch Testing of Multiple MEMS Package,” Microelectronics Reliability, Vol. 18, No. 3, pp. 577-587 (2010).
- C. Jang and B. Han, “Analytical and Molecular Simulation Study of Water Condensation Behavior in Mesopores with Closed Ends, The Journal of Chemical Physics, Vol. 132, 104702 (2010).
- I. Sher, B. Han and A. Bar-Cohen, “Modified Coupled-Mode Model for Thermally Chirped Polymer Bragg Gratings,” Applied Optics, Vol. 49, No. 11, pp. 2079 - 2084 (2010).
- C. Jang, S. Yoon and B. Han, “Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging,” IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, pp. 340-346 (2010).
- H. Bi, C. Jang and B. Han, “Nano-Pattern Recognition and Correlation Technique for Sub-Nanometer In-Plane Displacement Measurement,” Experimental Mechanics, Vol. 50, No. 8, pp. 1169-1181 (2010).
- P. Ifju and B. Han, “Recent Applications of Moiré Interferometry,” Experimental Mechanics, Experimental Mechanics, Vol. 50, No. 8, pp. 1129-1147 (2010).
- M. Arik, J. Jackson, S. Prabhakaran, C. Seeley, R. Sharma, Y. Utturkar, S. Weaver, G. Kuenzler and B. Han, “Development of a High Lumen Solid State Down Light Application,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 668-679 (2010).
- B. Han, C. Jang, A. Bar-Cohen and B. Song, “Coupled Thermal and Thermo-mechanical Design Assessment of High Power Light Emitting Diode,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 688-697 (2010).
- D. W. Kim, E. Rahim, A. Bar-Cohen and B. Han, “Direct Submount Cooling of High Power LED’s,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 698-712 (2010).
- B. Song, B. Han, A. Bar-Cohen, R. Sharma and M. Arik, “Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 728-737 (2010).
- C. Jang, B. Han and S. Yoon, “Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds over Solder Reflow Process Temperature,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 809-818 (2010).
2009
- C. Jang and B. Han, “Analytical Solutions of Gas Transport Problems in Inorganic/Organic Hybrid Barrier Structures,” Journal of Applied Physics, 105, 093532 (2009).
- A. Goswami, B. Han, S.-J. Ham and B.-G. Jeong, “Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using a Helium Mass Spectrometer”, IEEE Transactions on Advanced Packaging, Vol. 32, No. 2, pp. 440-447 (2009).
- C. Jang, A. Goswami and B. Han, “Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 18, No. 3, pp. 577-587 (2009).
- C. Jang, A. Goswami, B. Han and S. Ham, “In-situ Measurement of Gas Diffusion Properties of Polymeric Seals Used in MEMS Packages by Optical Gas Leak Test,” Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 8, No. 4, 043025 (2009).
2008
- Y. Wang, B. Han, D. W. Kim, A. Bar-Cohen and P. Joseph, “Integrated Measurement Technique for Curing Process-dependent Mechanical Properties of Polymeric Materials Using Fiber Bragg Grating,” Experimental Mechanics, Vol. 48, pp. 107-117 (2008).
- A. Goswami and B. Han, “On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages,” IEEE Transactions on Advanced Packaging, Vol. 31, No. 1, pp. 14-21 (2008).
- C. Jang, S. Park, B. Han and S. Yoon, “Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem, Journal of Electronic Packaging, Vol. 130, pp. 011004 (2008).
- S. Yoon, C. Jang and B. Han, “Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading,” Journal of Electronic Packaging, Vol. 130, 024502-1/6 (2008).
- C. Jang, Y. Cho and B. Han, “Ideal Laminate Theory for Water Transport Analysis of Inorganic/Organic Multilayer Barrier Films,” Applied Physics Letters, Vol. 93, 13307 (2008).
- A. Goswami and B. Han, “On Applicability of MIL-Spec-Based Helium Fine Leak Test to Packages with Sub-micro liter Cavity Volumes”, Microelectronics Reliability, Vol. 48, pp. 1815–1821 (2008).