Avram Bar-Cohen Honored by IEEE

Department of Mechanical Engineering Chairman Avram Bar-Cohen was recently honored by the Components, Packaging and Manufacturing Technology Society of the IEEE. Dr. Bar-Cohen received the Outstanding Sustained Technical Contribution Award for his many contributions in the area of thermal management.

Dr. Bar-Cohen's research expertise is in thermal design, ebullient heat transfer, and thermal phenomena in microelectronic, photonic, and biological systems, as well as technology forecasting and management of technology. In addition, he has become a pioneer in the research of nontraditional area of thermal packaging of electronic equipment. Dr. Bar-Cohen currently serves on the Steering Committee of the ASME Nanotechnology Institute and is Chair of the US Scientific Committee of the International Heat Transfer Assembly (1998-2002), and is editor-in-chief of the IEEE Transactions on Components & Packaging Technologies.

The Department of Mechanical Engineering offers their heartiest congratulations.

Published May 23, 2002