CALCE, ME Student, Hao Huang, Receives Outstanding Poster Award

Hao Huang, a student of Professor Dasgupta, received the Outstanding Poster Award at the 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation in Microelectronics and Microstystems (EureoSimE) in Toulouse, France. The poster (abstract below), presented by Prof. Dasgupta, examined Huang’s research on ‘Mechanistic Model for the Stress-Strain Response of Double-Layered PSA.’

EuroSimE is an IEEE conference that covers trends in the electronics industry, including the rapid development and evolving application of advanced simulation methodologies. Leading companies across the globe rely on simulations for product and process development.

EuroSimE covers all fields of microelectronics and microsystems, including:

• Wafer processing
• Chip design
• PWB design and application
• Components and packaging
• Interconnections
• Systems
• Materials and processes of microelectronics

Abstract: Experiments and modeling are used to understand the mechanics of the deformation mechanisms in double-layers pressure sensitive adhesives (PSAs). The mechanical role of the carrier layer and the resulting stress state in a double-layered pressure-sensitive adhesive (PSA) system is presented in this paper. This description of the deformation mechanism is developed based on empirical results of stress-strain response of double-layered PSA-bonded assemblies and in-situ observation of the deformation of carrier layer during the debonding process. This study of double-layered PSAs, is motivated by the fact that there are currently very few studies in the literature regarding the mechanics behind the secondary transition observed in the stress-strain and creep responses of PSA-bonded assemblies. Empirical observations verify that this behavior is due to sequential cavitation and fibrillation in two adhesive layers caused by the new bonding interface introduced by the carrier layer. The effect of carrier thickness and strength of adhesion between PSA and substrates on the stress-strain response of double-layered PSA systems is also important. In-depth, physics-based understanding of the relationship between flexural rigidity of carrier layer and stress-strain performance of PSA-bonded assemblies will help to optimize the design of double-layered PSA joints for a given substrate material. The modeling tasks in this paper use finite element analysis is to understand the effects of carrier layer stiffness on the stress-strain response of PSA bonded assembly. Conclusions from this study will be applied to generate semi-analytic mechanistic models for modeling the stress-strain behavior of double-layered PSA joints. This modeling approach will be an enhancement of earlier model presented for single-layered PSAs.

Hao Huang is currently a PhD candidate in Mechanical Engineering and a graduate research assistant at the Center of Advance Life Cycle Engineering (CALCE), at the University of Maryland, College Park. He is advised by Professor Abhijit Dasgupta, and his dissertation research is to investigate the mechanical behavior of Pressure Sensitive Adhesive (PSA). He has worked on several other CALCE research projects, notably the test and simulation of effects of temperature humidity cycling on potted electronic assemblies. He has authored numerous papers in international and national conferences and made research presentations to CALCE sponsors. Before arriving at UMD, he graduated from Beijing Institute Technology with a B.S. in Theoretical and Applied Mechanics.

Published June 14, 2018