Professors Han & Pecht Honored With IEEE Best Paper AwardAssociate Professor of Mechanical Engineering Bongtae Han and Professor of Mechanical Engineering Michael Pecht were honored with the The Institute of Electrical and Electronics Engineers (IEEE) Transactions on Components and Packaging Technologies editor’s Best Paper Award of 2004.
Their paper, "Characterization of hygroscopic swelling behavior of mold compounds and plastic packages," co-written by Eric Stellrecht, was published in the September 2004 issue of Transactions. The paper was selected from nearly 100 manuscripts published in that year's volume of Transactions, which included many outstanding papers from authors from around the world.
The award will be presented at the upcoming 55th Electronic Components and Packaging Technology Conference (ECTC) in Lake Buena Vista (Orlando) Florida, during the CPMT Luncheon on Thursday, June 2, 2005.
The Award includes a $2500 cash prize (shared by the authors) and a certificate for each author. The department congratulates the authors on this wonderful recognition of their scholarship.
Published May 15, 2005