Credits: 3


Design considerations in the packaging of electronic systems. Production of circuit boards and design of electronic assemblies. Vibration, shock, fatigue and thermal considerations.

Semesters Offered

Fall 2017, Fall 2018, Fall 2019, Fall 2020, Fall 2021, Fall 2022, Fall 2023

Learning Objectives

  • Develop an understanding of the basic and fundamental operating principles of semiconductor devices (e.g. transistors), passive electronic devices (e.g. resistors, capacitors), and MEMS through lecture.
  • Develop a knowledge of the types of electronic packages and their constituent parts through lecture and a term project involving deconstruction of an electronic system.
  • Develop an ability to apply mathematics and physics to conduct basic and fundamental electrical, mechanical, and thermal analysis and design of electronic systems within realistic constraints understanding the impacts in an economic, environmental, and societal context, including
    • Layout design of a circuit card to minimize signal distortion and temperature gradients, while assuring manufacturability
    • Development of a thermal management plan to minimize energy consumption
    • Create assemblies with lead-free solders to minimize the deleterious environmental and health effects of lead and to increase sustainability
    • Conduct mechanical stress analysis on an assembly subjected to shock, vibration, and/or temperature cycling to ensure safety and reliability.
  • Enhance the ability to function on multidisciplinary teams and to communicate effectively through the semester project which is performed in groups of 3 to 5 students and for which there is an written report and in-class presentation at the end of the semester.  
  • Enhance your ability to use the techniques, skills, and modern engineering tools necessary for engineering practice.  This is emphasized through the use of analytical tools, such as scanning electron microscopy and X-ray analysis along with computational fluid dynamics, heat transfer, and mechanical stress analysis simulation tools, such as Flotherm, Icepak, ANSYS Workbench in the deconstruction project.


Topics Covered

  • Fundamental operating principles of active and passive electronic devices
  • MEMS and microsystems
  • Design of component level packaging (i.e. wirebonds, flip chip, die attach, substrates, encapsulants)
  • Taxonomy of compionent packaging (e.g. QFN, BGA, CSP)
  • Design of circuit boards (i.e. signal attenuation/distortion, routing, materials)
  • Manufacturing of circuit boards (i.e., electroplating, lamination, panelization)
  • Lead-free soldering and environmental impacts
  • Additive vs. subtractive manufacturing techniques
  • Heat transfer, thermal analysis, and cooling techniques
  • Reliability analysis (especially thermal, vibration, and shock fatigue)


Learning Outcomes

  • an ability to apply knowledge of mathematics, science, and engineering
  • an ability to design a system, component, or process to meet desired needs within realistic constraints such as economic, environmental, social, political, ethical, health and safety, manufacturability, and sustainability
  • an ability to function on multi-disciplinary teams
  • an ability to communicate effectively
  • the broad education necessary to understand the impact of engineering solutions in a global, economic, environmental, and societal context
  • a recognition of the need for, and an ability to engage in life-long learning
  • a knowledge of contemporary issues
  • an ability to use the techniques, skills, and modern engineering tools necessary for engineering practice

Additional Course Information


McCluskey, F. Patrick


None required.

Class/Laboratory Schedule 

  • Two 75 minute lectures per week
Last Updated By 
F. Patrick McCluskey, June 2017