DescriptionAn understanding of the fundamental mechanical principles used in desig of electronic devices and their integration into electronic systems will be provided. Focus will be placed on the effect of materials compatibility, thermal stress, mechanical stress, and environmental exposure on product performance, durability and cost. Both electronic devices and package assemblies will be considered. Analysis of package assemblies to understand thermal and mechanical stress effects will be emphasized through student projects.
Semesters OfferedFall 2017, Fall 2018, Fall 2019