ME Lab Presents Workshop on Thermal Packaging of High Flux Military and Commercial Electronics

On Monday, October 7, 2002, the Department of Mechanical Engineering's Smart and Small Thermal Systems Laboratory hosted a workshop on Thermal Packaging of High Flux Military and Commercial Electronics.

This highly successful workshop's main charge was to identify the next round of emerging technologies in thermal management of high flux electronics. Attendance was by invitation only, and was capped at 55 participants, and included authorities and technical experts from various electronics and computer manufacturers and aerospace industry. Government organizations such as NASA, the Naval Research Lab, and the Office of Naval Research were also present.

The various topics presented were broken down into three categories: Navy Systems: Needs, and Technology; Advanced Thermal Management for Aerospace Systems; and Recent Developments and Advances in Thermal Technology. An overview of the day was the culminating event.

The workshop included 12 invited speakers from academics, industry, and government, including Laboratory Director Michael Ohadi and Department of Mechanical Engineering Chair Avram Bar-Cohen. The proceedings are being edited and will be available at a nominal fee to the public.

For more information on the Smart and Small Thermal Systems Lab, visit their Website at

Published October 7, 2002