Faculty Directory

Osterman, Michael

Osterman, Michael

Senior Research Scientist
Director
CALCE Electronic Products and System Consortium
Mechanical Engineering
Center for Advanced Lifecycle Engineering

BACKGROUND

 

Dr. Michael Osterman (Ph.D., University of Maryland, 1991) is a Senior Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. He heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman served as a subject matter expert on phase I and II of the Lead-free Manhattan Project sponsored by Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP). He has consulted with automotive, medical, defense, and industrial electronic companies on the transition to lead-free materials. He organized and chaired the International Symposium on Tin Whiskers from 2007 to 2013. He has written eight book chapters and over 120 articles. He is a senior member of IEEE and a member of ASME, IMAPS and SMTA

 

Simulation assisted reliability assessment of electronic hardware

Solder interconnection fatigue testing and modeling

Corrosion testing for electronic equipment

 


2020

Energy Based Modeling for Temperature Cycling Induced Tin Silver Copper Solder Interconnect Fatigue Life, Deng Yun Chen, Michael Osterman, and Abhijit Dasgupta; Microelectronics Reliability, April 2020, DOI: 10.1016/j.microrel.2020.113651.

Development of a Cycle Counting Algorithm with Temporal Parameters, James M. Twomey, Deng Y. Chen, Michael D. Osterman, and Michael G. Pecht; Microelectronics Reliability, April 2020, DOI: 10.1016/j.microrel.2020.113652

2019

Experimental Approach to Determine Damage Curves for SnAgCu Solder Under Sequential Cyclic Loads , Elviz George, Deng Yun Chen, Michael Osterman, and Michael Pecht,  Journal of Electronics Materials, Early Access, PP 1-9, 2019, DOI: 10.1007/s11664-019-07811-5.

Life Cycle Trends of Electronic Materials, Processes and Components, Chien-Ming Huang, Jose A. Romero, Michael Osterman, Diganta Das, and Michael Pecht, Microelectronics Reliability, Vol. 99, pp. 262-276, August, 2019 DOI: 10.1016/j.microrel.2019.05.023.

Dr. Michael Osterman Receives University of Maryland Provost’s Excellence Award

Award recognizes outstanding research contributions made by professional track faculty on campus.

IEEE Prognostics and Health Management StandardPublished by IEEE Reliability Society

A working group, chaired by Prof. Michael Pecht, developed an IEEE standard for PHM of electronic systems.

Faculty Honors Barker

Department of Mechanical Engineering faculty celebrate the service of Professor Donald Barker at annual emeritus luncheon.

Preeti Chauhan Wins Best Student Paper Award

Paper focuses on canary approach to electronics failure.

CALCE Research Referenced by Huffington Post

Article on car acceleration problems utilizes research by Pecht, Sood, and Osterman

ME / CALCE Students Receive Best Paper Award

Professor Pecht’s students honored at IMAPS Microelectronics Workshop.

ME Students Receive Best Paper Award

Professor Pecht's students honored at IMAPS Microelectronics Workshop.

Pecht to Deliver Keynote Address at IEEE Symposium

Lifetime Achievement Award recipient to discuss new approach to qualification testing.