Faculty Directory

McCluskey, F. Patrick

McCluskey, F. Patrick

Leader, Electronics and Product Systems Division
Director of Undergraduate Studies
Mechanical Engineering
Maryland Energy Innovation Institute
2125 Glenn L. Martin Hall, Building 088


  • Ph.D., Lehigh University, 1991
  • M.S., Lehigh University, 1986
  • B.S., Lafayette College, 1984


  • Associate Editor, IEEE Components and Packaging Technologies
  • Co-organizer of Symposium N: Microelectronics and Microsystem Packaging, Materials Research Society Spring Meeting (2001)
  • Organizing Committee and Short Course Director, Fifth International High Temperature Electronics Conference (June 2000)
  • Member, NSF Proposal Review Panel on Materials Processing and Manufacturing
  • Technical Program Chair, IMAPS International Conference on High Temperature Electronics, (2004, 2006, 2008)
  • Technical Program Committee for SIA Int'l Conference on Automotive Power Electronics (2009)
  • Organizing Committee for the CIPS Conference (2010, 2012)
  • Organizing Committee for IMAPS European High Temperature Electronics Conference (2009, 2011)

High temperature and high power electronics packaging, materials, and reliability


  • P. Quintero, F. P. McCluskey, "Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment," J. Microelectronics and Electronic Packaging,  Vol. 6, pp. 66-74.  (2009).
  • R. W. Chang and F. P. McCluskey, "Reliability Assessment of Indium Solder for Low Temperature Electronic Packaging," Cryogenics, 49 (11), pp. 630-634 (2009).


  • F. P. McCluskey, M. Dash, Z. Wang, and D. Huff, "Reliability of High Temperature Solder Alternatives," Microelectronics Reliability, Vol. 46, No. 9-11, pp. 1910-1914 (2006).


  • Chandrasekaran and F. P. McCluskey, "Effect of Green Molding Compounds on High Temperature Wirebond Reliability," Micromaterials and Nanomaterials, Issue 3. Vol. 2004.  pp. 134-143, (2004).


  • K. Meyyappan, P. McCluskey, and L. Chen, "Thermomechanical Analysis of Gold-Based SiC Die Attach Assembly," IEEE Trans Device and Materials Reliability, Vol. 3, No. 4. pp. 152-158, (2003).


  • McCluskey, F.P., "Fatigue and Intermetallic Formation in Lead Free Soldier Die Attach," Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 9-13, 2001, Kauai, HI.
  • McCluskey, F.P., "A Web-Based Graduate Course on the Mechanical Design of High Temperature and High Power Electronics," Proceedings of the Electronic Component and Technology Conference, Lake Buena Vista, FL, May 30, 2001, pp. 397-400.


  • McCluskey, F.P., K. Mensah, C. O'Connor, and A. Gallo, " Reliable Use of Commercial Technology in High Temperature Environments," Microelectronics Reliability, Vol. 40, pp. 1671-1678 (2000).
  • McCluskey, F.P., Y.D. Kweon, H.J. Lee, J.W. Kim, and H.S. Jeon, "Method for Assessing Remaining Life in Electronics Assembles," Microelectronics Reliability, Vol. 40, No. 2, pp. 293-306 (2000).


  • Palli, N., S. Azarm, F.P. McCluskey, and R. Sundararajan, "An Interactive Multistage e-Inequality Constraint Method for Multiple Objectives Decision Making," Journal of Mechanical Design, Vol. 120, pp. 678-686 (December 1998).
  • R.R. Grzybowski and F.P. McCluskey, "High Temperature Performance of Polymer Film Capacitors," Journal of Microelectronic Packaging, Vol. 1, pp. 153-158 (1998).
  • McCluskey, P., F. Lilie, O. Beysser, A. Gallo, “Low Temperature Delamination of Plastic Encapsulated Microcircuits,” Microelectronics Reliability, Vol. 38, No. 12, pp. 1829-1834 (December 1998).
  • McCluskey, F.P., E.B, Hakim, J. Fink, A. Fowler, and M. Pecht, “Reliability Assessment of Electronic Components Exposed to Long-Term Non-Operating Conditions,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 21, No. 2, pp. 352-360 (June 1998).


  • McCluskey, F.P., M.B. Wright, and D. Humphrey, "Uprating Electronic for Use Outside their Temperature Specifications Limits,"  IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 20, No. 2, pp. 252-256 (1997).
  • McCluskey, F.P., D. Das, J. Jordan, R.R. Grzybowski, J. Fink, L. Condra, and T.C. Torri, "Packaging of Electronics for High Temperature Applications," The International Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 3, pp. 409-423 (1997).
  • McCluskey, F.P., R. Munamarty, and M. Pecht, "Popcorning in PBGA Packages During IR Reflow Soldering," Microelectronics International, No. 42, pp. 20-23 (1997).


  • McCluskey, F.P., R.R. Grzybowski, and T.F. Podlesak, eds., "High Temperature Electronics," CRC Press, Boca Raton, FL (1996).

A Wider Lens

UMD engineering faculty are finding ways to introduce sustainability concepts throughout the curriculum.

UMD Selected for $3.5M ARPA-E COOLERCHIPS Award

Researchers will help develop more efficient cooling for data centers.

Prof. Patrick McCluskey and Dr. Diganta Das receive MIPS Award

JumpLights, Inc, Prof. McCluskey, Dr. Diganta Das, Maryland Industrial Partnerships (MIPS) award

Profs. Dasgupta, McCluskey and Students Present at ITherm 2018

CALCE students present at ITherm conference, professors lead HIR task force

Khaligh, McCluskey to lead new $2.37M DOE solar power converter project

By funding these kinds of projects, DOE hopes to dramatically reduce the cost of solar energy.

Khaligh, McCluskey receive Boeing funding for more electric aircraft

The team is developing the world’s first wide-bandgap GaN-based modular Rectified Transformer Rectifier Units for commercial aircraft such as the Boeing 787.

Bar-Cohen Named President of IEEE Electronic Packaging Society

Professor Bar-Cohen began serving in this role January 1.

McCluskey Co-PI on NSF Partnership for Innovation Grant on Electric Vehicle Technology

Researchers will develop an onboard inegrated charger/converter.

UMD Researchers Creating First Onboard Fast-Charging System for Electric Vehicles

NSF funds innovative interdisciplinary research for Khaligh and McCluskey

UMD Students Win Poster Session at NASA's Thermal and Fluids Analysis Workshop

Graduate students Allison Porter (Aerospace Engineering) and David Squiller (Mechanical Engineering) placed second and third at 2015 NASA TFAW poster session.

Invention of the Year Nominee: A New Joint Soldering Paste with High Temperature Resistance

Innovation developed by McCluskey offers potential application in aviation, space exploration, and hybrid electric vehicles

UMD To Celebrate Innovations and Partnerships April 29

Nine nominees for Invention of the Year to be recognized at annual event

Clark School Faculty Promotions Announced

Faculty promoted to full professor, associate professor with tenure.

McCluskey Promoted to Full Professor

Associate Professor F. Patrick McClusky was promoted to rank of Professor in the Department of Mechanical Engineering.

Offshore Wind Energy and Reliability

Clark School professors support the State of Maryland's efforts to establish a resilient wind farm.

Four Mechanical Engineering Graduate Students Selected as Future Faculty Fellows

Althamer, Anderson, Greve and Singh Chosen for Clark School's 2014 Future Faculty Program

Exploring Offshore Wind Energy for Maryland

Md. Higher Education Commission funds Clark School study of reliability, cost-effectiveness of wind-generated energy.

Khaligh is PI for hybrid energy storage system NSF GOALI grant

New lightweight system will offer increased battery life for electric cars.

"Embedded Cooling" of Next-Generation Power Electronics

UMD Research Team wins $2.1 million contract from DARPA to develop "embedded cooling" technology

Mechanical Engineering Graduates Placed in Academia

Pedro Quintero and William McGill return to the classroom as Assistant Professors

Department Well-Represented at OTC Invention Awards

Professors Baz & McCluskey earn top recognition.

2006 ME Research Review Day Highlights

Research Review Day held on March 20, 2006 at the University Inn and Conference Center.

Workshop on Power Device Packaging Reliability Held

Associate Professor Patrick McCluskey hosted Workshop on Power Device Packaging Reliability at UMD.

Other professional society fellows

  • International Microelectronics and Packaging Society