Sochol, Ryan D.
Fischell Department of Bioengineering
Maryland Robotics Center
Dr. Sochol’s Bioinspired Advanced Manufacturing (BAM) Laboratory utilizes state-of-the-art micro/nanoscale 3D printing approaches to solve mechanically and physically complex engineering challenges with a focus on biomedical applications.
- Ph.D., University of California, Berkeley (2011)
- M.S., University of California, Berkeley (2009)
- B.S., Northwestern University (2006)
- NIH Fellow within the Harvard-MIT Division of Health Sciences & Technology, Harvard Medical School, and Brigham & Women’s Hospital
- Director of the Micro Mechanical Methods for Biology (M3B) Laboratory Program within the Berkeley Sensor & Actuator Center at the University of California, Berkeley
- Visiting Postdoctoral Fellow within the Institute of Industrial Science at the University of Tokyo
- Micro/Nanoscale 3D Printing
- Advanced Manufacturing
- Cell Mechanobiology & Physicobiology
- Soft Robotics
- Integrated Microfluidic Circuitry
- 3D Microelectronics
ENME 744: Additive Manufacturing
Note: ENME 744 is the only required course of the Masters of Engineering: “Additive Manufacturing Certificate” Program.
Selected Journal Publications
- Abdullah T. Alsharhan, Ruben Acevedo, Roseanne Warren, and Ryan D. Sochol, “3D Microfluidics via Cyclic Olefin Polymer-Based In Situ Direct Laser Writing,” Lab on a Chip, Vol. 19, pp. 2799-2810, 2019. (Featured on the Front Cover)
- Andrew C. Lamont, Michael A. Restaino, Matthew J. Kim, and Ryan D. Sochol, “A Facile Multi-Material Direct Laser Writing Strategy,” Lab on a Chip, Vol. 19, pp. 2340-2345, 2019. (Selected as a “Hot Article”; Featured on the Inside Front Cover)
- Andrew C. Lamont, Abdullah T. Alsharhan, and Ryan D. Sochol, “Geometric Determinants of In-Situ Direct Laser Writing,” Scientific Reports, Nature Publishing Group, Vol. 9, pp. 394, 2019.
- Ryan D. Sochol, Eric Sweet, Casey C. Glick, Sunita Venkatesh, Kjell F. Ekman, Armen Avetisyan, Ashley Tsai, Andrius Raulinaitis, Aaron Weinkers, Kevin Korner, Karli Hanson, Alison Long, Ben J. Hightower, Gregory Slatton, David Burnett, Travis Massey, Kosuke Iwai, Luke P. Lee, Kristofer S.J. Pister, and Liwei Lin, “3D Printed Microfluidic Circuitry via Multijet-Based Additive Manufacturing,” Lab on a Chip, Vol. 16, pp. 668-678, 2016. (Featured on the Inside Back Cover; Lab on a Chip 2016 Top 25 Most Downloaded Articles)
- Ryan D. Sochol, Adrienne T. Higa, Randall R.R. Janairo, Song Li, and Liwei Lin, “Unidirectional Mechanical Cellular Stimuli via Micropost Array Gradients,” Soft Matter, Vol. 7, pp. 4606-4609, 2011. (Selected as a “Hot Article”; Featured on the Inside Front Cover)
Selected Conference Publications
- (Oral Presentation | YouTube Link) Andrew C. Lamont, Michael Restaino, and Ryan D. Sochol, “Rapid Multi-Material Direct Laser Writing,” Proceedings of the 32nd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2019), Seoul, Korea. (Outstanding Paper Award Winner)
- (Oral Presentation | YouTube Link) Joshua D. Hubbard, Chase Manny, Andrew Montgomery, Brian Freeman, Alec Boyle, and Ryan D. Sochol, “Multi-Material 3D Printed Microfluidic Circuitry Components,” Proceedings of the 21st International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS 2017), Savannah, GA.
- (Oral Presentation | YouTube Link) Ryan D. Sochol, Yun Jung Heo, Shintaroh Iwanaga, Jonathan Lei, Ki Tae Wolf, Albert Lu, Makoto Kurihara, Saori Mori, Daniela Serien, Song Li, Liwei Lin, and Shoji Takeuchi, “Cells on Arrays of Micro-Springs: An Approach to Achieve Tri-Axial Control of Substrate Stiffness,” Proceedings of the 26th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2013), Taipei, Taiwan. (Outstanding Oral Presentation Award Finalist)
- (Oral Presentation | YouTube Link) Ryan D. Sochol, Ryan Ruelos, Valerie Chang, Megan E. Dueck, Luke P. Lee, and Liwei Lin, “Continuous Flow Layer-by-Layer Microbead Functionalization via a Micropost Array Railing System,” Proceedings of the 16th International Conference on Solid-State Sensors, Actuators and Microsystems (IEEE Transducers 2011), Beijing, China. (Outstanding Paper Award Winner)